Remember those renders claimed to portray the iPhone XI (the successor to the XS) with a huge ghastly camera bump on the back? Today sees the leak of the alleged “final” CAD-based renders of the iPhone XI, and – shock horror – the hump is still there.
In terms of surface area, this has to be the biggest bump ever seen on a smartphone, so Apple can brag about that in its presentation this fall. Jokes aside, if this is indeed the final design of the iPhone XI (or whatever it will end up being called), then it’s going to be polarizing to say the least.
Anyway, the huge hump houses three camera sensors and a pretty big LED flash array, along with a mic hole. Interestingly, the entire back of the device is made from one single sheet of glass – that’s also covering the camera bump.
On the front there’s a 5.8″ AMOLED display with its size unchanged from the iPhone X and XS. The source of these images says the bezels all-round have gotten ever so slightly (but not noticeably) thinner, and yet the upcoming phone is bigger on all axes than its predecessor, so something doesn’t add up there.
The iPhone XI’s dimensions are reportedly going to be 143.9 x 71.4 x 7.8 mm, while the XS clocks in at 143.6 x 70.9 x 7.7 mm. The mute switch on the side now looks different, and it’s similar to those found in old iPads. There’s no trace of a USB-C connector at the bottom, as Apple is apparently still going to be using Lightning for this generation of phones.
The company is expected to unveil the successors to the iPhone XS, XS Max, and XR in September as usual, with availability following soon after that.
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Source: GSMArena.com – Latest articles